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Paperback version af RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging

Forfatter: info mangler
Bog
  • Format
  • Bog, paperback
  • Engelsk

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kr. 1.084,95

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kr. 1.029,95
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Beskrivelse

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

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Detaljer
Størrelse og vægt
coffee cup img
10 cm
book img
15,5 cm
23,5 cm

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Electronics Electronic packaging Simulation Composite material Material Thermal management 3D Packaging High-Frequency Electronics packaging and processing methods thermal mechanical designs