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Hardback version af Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® af Erdogan Madenci, Ibrahim Guven, Bahattin Kilic

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

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Beskrivelse

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis.

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

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10 cm
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15,5 cm
23,5 cm

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Serier

The Springer International Series in Engineering and Computer Science The Springer International Engineering and Computer Science Kluwer International Series in Engineering and Computer Scie Springer International Series in Engineering and Computer Science

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